E2E1027-27-Y4
This version: Jan. 1998
Previous version: Nov. 1996
¡ Semiconductor
MSM66201/66P201/66207/
66P207
OLMS-66K Series 16-Bit Microcontroller
GENERAL DESCRIPTION
The MSM66201/66207 is a high performance microcontroller that employs OKI original nX-8/
200 CPU core. This chip includes a 16-bit CPU, ROM, RAM, I/O ports, multifunction 16-bit
timers, 10-bit A/D converter, serial I/O port, and pulse width modulator (PWM). The
MSM66P201/66P207 is the OTP (One-Time Programmable) version of the MSM66201/66207.
FEATURES
• 64K address space for program memory
• 64K address space for data memory
: Internal ROM : MSM66201
MSM66207
16K bytes
32K bytes
512 bytes
1024 bytes
: Internal RAM : MSM66201
MSM66207
• High-speed execution
Minimum cycle for instruction
• Powerful instruction set
: 400ns @ 10MHz
: Instruction set superior in orthogonal matrix
8/16-bit data transfer instructions
8/16-bit arithmetic instructions
Multiplication and division operation instructions
Bit manipulation instructions
Bit logic instrucitons
ROM table reference instructions
: Register addressing
• Abundant addressing modes
Page addressing
Pointing register indirect addressing
Stack addressing
Immediate value addressing
• I/O port
Input-output port
: 5 ports ¥ 8 bits
(Each bit can be assigned to input or output)
Input port
• Built-in multifunctional 16-bit timer
Following 4 modes can be set for each timer : Auto-reload timer mode
Clock output mode
: 1 port ¥ 8 bits
: 4
Capture register mode
Real time output mode
• Serial port
: 1 channel (Synchronous/UART switchable
mode with baud rate generators)
: 2
• 16-bit pulse width modulator
• Watchdog timer
• Transition detector
• 10-bit A/D converter
• Interrupts
: 4
: 8 channels
Nonmaskable
Maskable
: 1
: Internal 16/external 2
• Stand-by function
STOP mode
: Software clock stop mode
: Software CPU stop mode
: Hardware CPU stop mode
HALT mode
HOLD mode
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¡ Semiconductor
MSM66201/66P201/66207/66P207
BLOCK DIAGRAM
P5
P4
P3
P2
P1
P0
HLDA/P2.5
HOLD/P2.4
FLT
RES
OSC1
OSC0
GND
VDD
3/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
PIN CONFIGURATION (TOP VIEW)
AD0/P0.0
AD1/P0.1
AD2/P0.2
AD3/P0.3
AD4/P0.4
AD5/P0.5
AD6/P0.6
AD7/P0.7
A8/P1.0
1
2
3
4
5
6
7
8
9
64 VDD
63 VREF
62 AGND
61 P5.7/AI7
60 P5.6/AI6
59 P5.5/AI5
58 P5.4/AI4
57 P5.3/AI3
56 P5.2/AI2
55 P5.1/AI1
54 P5.0/AI0
53 P4.7/TRNS3
52 P4.6/TRNS2
51 P4.5/TRNS1
50 P4.4/TRNS0
49 P4.3/PWM1
48 P4.2/PWM0
47 P4.1/TM1CK
46 P4.0/TM0CK
45 P3.7/TM3IO
44 P3.6/TM2IO
A9/P1.1 10
A10/P1.2 11
A11/P1.3 12
A12/P1.4 13
A13/P1.5 14
A14/P1.6 15
A15/P1.7 16
P2.0 17
P2.1 18
P2.2 19
CLKOUT/P2.3 20
RESOUT 21
22
23
24
43
42
41
ALE
PSEN
RD
P3.5/TM1IO
P3.4/TM0IO
P3.3/INT1
WR 25
READY 26
EA 27
40 P3.2/INT0
39 P3.1/RXD
38 P3.0/TXD
37 P2.7/RXC
36 P2.6/TXC
35 P2.5/HLDA
34 P2.4/HOLD
FLT 28
RES 29
OSC0 30
OSC1 31
GND
NMI
32
33
64-Pin Plastic Shrink DIP
4/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
PIN CONFIGURATION (TOP VIEW) (Continued)
A8/P1.0
A9/P1.1
A10/P1.2
A11/P1.3
A12/P1.4
A13/P1.5
A14/P1.6
A15/P1.7
P2.0
1
2
3
4
5
6
7
8
9
48 P5.2/AI2
47 P5.1/AI1
46 P5.0/AI0
45 P4.7/TRNS3
44 P4.6/TRNS2
43 P4.5/TRNS1
42 P4.4/TRNS0
41 P4.3/PWM1
40 P4.2/PWM0
39 P4.1/TM1CK
38 P4.0/TM0CK
37 P3.7/TM3IO
36 P3.6/TM2IO
35 P3.5/TM1IO
34 P3.4/TM0IO
33 P3.3/INT1
P2.1 10
P2.2 11
CLKOUT/P2.3 12
RESOUT 13
ALE 14
PSEN 15
RD 16
64-Pin Plastic QFP
5/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
PIN CONFIGURATION (TOP VIEW) (Continued)
AI3/P5.3
AI4/P5.4
AI5/P5.5
AI6/P5.6
AI7/P5.7
AGND
P3.2/INT0
P3.1/RXD
P3.0/TXD
P2.7/RXC
P2.6/TXC
P2.5/HLDA
P2.4/HOLD
NMI
61
62
63
64
65
66
67
68
1
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
VREF
VDD
GND
VDD
AD0/P0.0
AD1/P0.1
AD2/P0.2
AD3/P0.3
AD4/P0.4
AD5/P0.5
AD6/P0.6
AD7/P0.7
GND
2
OSC1
OSC0
3
4
RES
FLT
EA
READY
WR
5
6
7
8
9
NC : No-connection pin
68-Pin Plastic QFJ (PLCC)
6/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
PIN DESCRIPTION
Symbol
Type
Description
I/O
P0.0–P0.7/
AD0–AD7
P0: 8-bit input-output port. Each bit can be assigned to input or output.
AD: Outputs the lower 8 bits of program counter during external program memory fetch,
and receives the addressed instruction under the control of PSEN. This pin also
outputs the address and outputs or inputs data during an external data memory
access instruction, under the control of ALE, RD, and WR.
P1.0–P1.7/
A8–A15
I/O
I/O
P1: 8-bit input-output port. Each bit can be assigned to input or output.
A: Outputs the upper 8 bits of program counter (PC8–15) during external program
memory fetch. This pin also outputs the upper 8 bits of address during external
data memory access instructions.
P2.0–P2.2
P2.3/CLKOUT
P2: 8-bit input-output port. Each bit can be assigned to input or output.
CLKOUT: Output pin for supplying a clock to peripheral circuits.
HOLD: Input pin to request the CPU to enter the hardware power-down state.
P2.4/HOLD
P2.5/HLDA
HLDA: HOLD ACKNOWLEDGE: the HLDA signal appears in response to the HOLD
signal and indicates that the CPU has entered the power-down state.
P2.6/TXC
P2.7/RXC
TXC: Transmitter clock input/output pin.
RXC: Receiver clock input/output pin.
P3.0/TXD
P3: 8-bit input-output port. Each bit can be assigned to input or output.
TXD: Transmitter data output pin.
I/O
P3.1/RXD
P3.2/INT0
P3.3/INT1
P3.4/TM0IO
P3.5/TM1IO
P3.6/TM2IO
P3.7/TM3IO
RXD: Receiver data input pin.
INT: Interrupt request input pin.
Falling edge trigger or level trigger is selectable.
TM0IO-TM3IO: One of the following signals is output or input.
• Clock at twice the frequency range of the 16-bit timer overflow
• Load trigger signal to the capture register input
• Setting value output
Whether the signal is input or output depends on the mode.
P4.0/TM0CK
P4.1/TM1CK
I/O
P4: 8-bit input-output port. Each bit can be assigned to input or output.
TM0CK, TM1CK: Clock input pins of timer 0, timer 1.
P4.2/PWM0
P4.3/PWM1
P4.4 – P4.7/
TRANS: Transition detector.
The input pins which sense the falling edge and set the flag.
PWM: 16-bit pulse-width modulator output pin.
TRANS0 –
TRANS3
I
P5.0 – P5.7/
AI0 –AI7
P5: 8-bit input port.
AI: Analog signal input pin for A/D converter.
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¡ Semiconductor
MSM66201/66P201/66207/66P207
PIN DESCRIPTION (Continued)
Symbol
RESOUT
Type
Description
Outputs "H" level in the case of internal reset.
Reset to"L" level by program.
O
ALE
Address Latch Enable:
O
The timing pulse to latch the lower 8 bits of the address
output from port 0 when the CPU accesses the external
memory.
O
O
O
The strobe pulse to fetch to external program
memory.
PSEN
RD
Program Strobe Enable:
Output strobe activated during a bus read cycle.
Used to enable data onto the bus from the external data memory.
WR
Output strobe during a bus write cycle.
Used as write strobe to external data memory.
READY
I
I
Used when the CPU accesses low-speed peripherals.
EA
Normaly set to "H" level.
If set to "L" level, the CPU fetches the code from external program memory.
FLT
I
If FLT is "H" level, ALE, WR, RD, PSEN are set to "H" level when reset.
If FLT is set to "L", ALE, WR, RD, PSEN are set to floating level when reset.
I
RES
RESET input pin.
OSC0
OSC1
NMI
Basic clock oscillation pin.
Basic clock oscillation pin.
Non-maskable interrupt input pin (falling edge).
Reference voltage input pin for A/D converter.
Ground for A/D converter.
System power supply.
I
O
I
VREF
AGND
VDD
—
—
—
—
GND
Ground.
8/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
REGISTERS
Accumulator
15
0
ACC
Control Register (CR)
15
0
PSW
Bit 15 : Carry flag (CY)
Bit 14 : Zero flag (ZF)
Bit 13 : Half carry flag (HC)
Bit 12 : Data descriptor (DD)
Bit 8 : Master interrupt priority flag (MIP)
Bit 9,5,4: User flag (MIP)
Bit 2-0 : System control base 2-0 (SCB2-0)
15
0
PC
LRB
SSP
Pointing Register (PR)
15
0
X1
Index Register 1
Index Register 2
X2
DP
Data Pointer
User Stack Pointer
USP
Local Register
7
0
7
0
ER0
ER1
ER2
ER3
R1
R0
R2
R4
R6
R3
R5
R7
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¡ Semiconductor
MSM66201/66P201/66207/66P207
SFR
Address
(HEX)
8/16-bit
Operation
Name
Symbol R/W
Reset
0000
FFH
FFH
SSP
(ASSP)
System stack printer
0001
0002
0003
0004I
0005I
0006
0007
0010I
0011
0012I
0013
0018
0019
001A
001B
001CI
0020
0021
0022
0023
0024
0025
0026I
0028
0029
002A
002C
002D
002E
002F
LRB
(ALRB)
undefined
Local register base
Program status word
Accumulator
R/W
8/16
PSWL
C8H
0CH
00H
00H
F8H
(APSW)
PSWH
ACC
Standby control register
Watchdog timer
SBYCON
00H/WDT
WDT
W
R/W
W
is stopped
8
FDH
"0"
Peripheral control register
Stop code acceptor
PRPHF
STPACP
00H
Interrupt request register
Interrupt enable register
IRQ
IE
00H
8/16
00H
00H
FCH
External Iinterrupt control register
Port 0 data register
EXICON
P0
undefined
00H
Port 0 mode register
P0IO
P1
undefined
00H
Port 1 data register
Port 1 mode register
R/W
P1IO
P2
undefined
00H
Port 2 data register
Port 2 mode register
P2IO
P2SF
P3
8
07H
Port 2 secondary function control register
Port 3 data register
undefined
00H
Port 3 mode register
P3IO
P3SF
P4
00H
Port 3 secondary function control register
Port 4 data register
undefined
00H
Port 4 mode register
P4IO
P4SF
P5
00H
Port 4 secondary function control register
Port 5
—
R
0030
0031
0032
0033
0034
0035
0036
0037
00H
Timer 0 counter
Timer 0 register
Timer 1 counter
Timer 1 register
TM0
TMR0
TM1
00H
00H
00H
R/W
16
00H
00H
00H
TMR1
00H
Note: A I mark in the address column indicates that there is a bit that does not exist in the
register.
10/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
SFR (Continued)
Addres
(HEX)
Abbreviated
8/16-bit
Operation
Name
R/W
Reset
Name
0038
00H
00H
Timer 2 counter
0039
TM2
003A
00H
Timer 2 register
003B
TMR2
TM3
00H
16
003C
00H
Timer 3 counter
003D
00H
003E
00H
Timer 3 register
003F
TMR3
00H
0040
00H
Timer 0 control register
TCON0
TCON1
TCON2
TCON3
TRNSIT
STTM
0041
00H
Timer 1 control register
R/W
0042
00H
Timer 2 control register
0043
00H
Timer 3 control register
0046I
0048
undefined
00H
Transition detector register
Serial port transmission baud rate generator counter
Serial port transmission baud rate generator register
0049
00H
STTMR
STTMC
004AI
0CH
Serial port transmission baud rate generator control
register
Serial port receiving baud rate generator counter
8
004C
00H
00H
0EH
SRTM
SRTMR
SRTMC
004D
Serial port receiving baud rate generator register
Serial port receiving baud rate generator control
register
004EI
Serial port transmission mode control register
Serial port transmission data buffer register
Serial port receiving mode control register
Serial port receiving data buffer register
Serial port receiving error register
A/D scan mode register
0050I
0051
80H
undefined
00H
STCON
STBUF
W
R/W
R
0054
SRCON
SRBUF
SRSTAT
0055
undefined
F0H
0056I
0058I
0059I
0060I
0061
80H
ADSCAN R/W
ADSEL
A0H
A/D select mode register
A/D conversion result register 0
ADCR0
R
8/16
undefined
Note: A I mark in the address column indicates that there is a bit that does not exist in the
register.
11/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
SFR (Continued)
Address
(HEX)
Abbreviated
Name
8/16-bit
operation
Name
R/W
Reset
0062I
A/D conversion result register 1
A/D conversion result register 2
A/D conversion result register 3
A/D conversion result register 4
A/D conversion result register 5
A/D conversion result register 6
A/D conversion result register 7
PWM 0 counter
ADCR1
ADCR2
ADCR3
ADCR4
ADCR5
ADCR6
ADCR7
PWMC0
PWMR0
0063
0064I
0065
0066I
0067
R
undefined
0068I
0069
006AI
006B
006CI
006D
006EI
006F
8/16
0070
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
0071
0072
PWM 0 register
0073
0074
PWM 1 counter
PWMC1 R/W
PWMR1
0075
0076
PWM 1 register
0077
0078
PWM 0 control register
PWM 1 countrol register
PWCON0
PWCON1
8
007A
Note: A I mark in the address column indicates that there is a bit that does not exist in the
register.
12/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
ADDRESSING MODES
The MSM66201/66207 provides independent 64K-byte data and 64K-byte program space with
varioustypesofaddressingmodes.Thesemodesareshownbelow,forbothRAM(fordataspace)
and ROM (for program space).
1. RAM Addressing Modes (for data space)
1.1
Register Direct Addressing
Example
ROR
DP
DP
1.2
Displacement Addressing
a) Zero Page
Example
L
0000H
0018H
A, 18H
SFR
b) Direct Page
Example
xx00H
xx10H
ST
A, off 10H
RAM
1.3
Pointing Register (PR) Indirect Addressing
a) Data Point (DP) Indirect
Example
SLL
[DP]
DP
RAM
b) User Stack Pointer (USP) Indirect
Example
SRL 10H [USP]
RAM
USP
–128 to +127
13/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
c) Index Register (X1, X2) Indirect
Example
INC 300H [X1]
RAM
X1
0 to 65535
1.4
Immediate Addressing
Example
MOV
SSP, #27FH
2. ROM Addressing Modes (for program space)
2.1
Direct Addressing
Example
LC
200H
A,
ROM
0200H
2.2
Simple Indirect Addressing
a) Local Register Indirect
Example
LC
A,[ER0]
ER0
ROM
b) Pointing Register Indirect
1)
Data Pointer (DP) Indirect
Example
LC
A, [DP]
DP
ROM
2)
User Stack Pointer (USP) Indirect
Example
LC
A,[USP]
USP
ROM
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¡ Semiconductor
MSM66201/66P201/66207/66P207
3)
Index Register (X1, X2) Indirect
Example
LC
A, [X1]
X1
ROM
ROM
c) System Stack Pointer (SSP) Indirect
Example
LC
A,[SSP]
SSP
d) Local Register Base (LRB) Indirect
Example
LC
A,[LRB]
LRB
ROM
e) RAM Indirect
Example
J
A, [0C0H]
RAM
ROM
0C0H
2.3
Double Indirect Addressing
a) Data Pointer (DP) Double Indirect
Example
J
[[DP]]
RAM
ROM
DP
b) User Stack Pointer (USP) Double Indirect
Example
LC A, [–2 [USP]]
RAM
ROM
USP
–128 to +127
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¡ Semiconductor
MSM66201/66P201/66207/66P207
c) Index Register (X1, X2) Double Indirect
Example
LC A, [10000H [x1]]
RAM
ROM
X1
0 to 65535
2.4
Indirect Addressing with 16-bit Offset
a) Pointing Register Indirect
1)
2)
3)
Data Pointer (DP) Indirect
Example
LC
A, [100H [DP]]
ROM
DP
0 to 65535
User Stack Pointer (USP) Indirect
Example
LC A, [100H [USP]]
ROM
USP
0 to 65535
Index Register (X1, X2) Indirect
Example
LC
A, [100H [X1]]
ROM
X1
0 to 65535
b) RAM Indirect
Example
LC A, [2000H [80H]]
RAM
80H
ROM
0 to 65535
16/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
MEMORY MAPS
Program Memory Space
0000H
0000H
Vector
Table
Area
(40 bytes)
0027H
0028H
Internal
ROM Area
VCAL
Table
Area
(16 bytes)
0037H
0038H
7FFFH *
External
Memory
FFFFH
7FFFH *
* MSM66201 : 3FFFH
Data Memory Space
0000H
0000H
SFR Area
PR Area
Special
Function
Registors
007FH
0080H
Zero
00BFH
Page
00C0H
PORT, A/DC,
TIMER, PWM,
etc....
00FFH
0100H
007FH
0080H
Internal
RAM
80
82
(Low Order)
(High Order)
PR0
PR1
PR2
PR3
PR4
PR5
PR6
PR7
X1
X2
Area
047FH *
84
86
DP
USP
00BFH
00C0H
External
Memoly
Area
FFFFH
047FH *
* MSM66201 : 027FH
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¡ Semiconductor
MSM66201/66P201/66207/66P207
ABSOLUTE MAXIMUM RATINGS
(Ta=25°C)
Parameter
Supply Voltage
Symbol
VDD
VI
Condition
Rating
–0.3 to 7.0
–0.3 to VDD+0.3
–0.3 to VDD+0.3
–0.3 to VDD+0.3
–0.3 to VREF
930
Unit
Input Voltage
Output Voltage
VO
V
GND=AGND=0V
Analog Ref. Voltage
Analog Input Voltage
VREF
VAI
64-pin shrink DIP
Ta=85°C
per Package
Power Dissipation
PD
64-pin QFP
68-pin QFJ
—
565
mW
°C
1120
–55 to +150
Storage Temperature
TSTG
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Symbol
VDD
Condition
fOSC £ 10MHz
fOSC = 0Hz
Range
4.5 to 5.5
2.0 to 5.5
0 to 10
–40 to +85
20
Unit
V
Memory Hold Voltage
Operating Frequency
Ambient Temperature
VDDH
fOSC
MHz
°C
V
DD = 5V 10%
Ta
—
MOS load
P0
Fan Out
N
2
—
TTL load
P1, P2, P3, P4
1
18/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VDD = 5V 10%, Ta = –40 to +85°C)
Parameter
Symbol
Condition
Min.
2.4
4.0
4.2
3.6
–0.3
–0.3
–0.3
4.2
4.2
—
Typ.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
5
Max.
VDD+0.3
VDD+0.3
VDD+0.3
VDD+0.3
0.8
Unit
"H" Input Voltage 1, 3, 6
"H" Input Voltage 5, 7
"H" Input Voltage 8
"H" Input Voltage 2
"L" Input Voltage 1, 2, 3, 6
"L" Input Voltage 5, 7
"L" Input Voltage 8
VIH
—
VIL
—
0.8
V
0.4
"H" Output Voltage 1, 4
"H" Output Voltage 2
"L" Output Voltage 1, 4
"L" Output Voltage 2
Input Leakage Current 3, 6, 7
Input Current 5
—
IO = –400mA
IO = –200mA
IO = 3.2mA
IO = 1.6mA
VOH
VOL
—
0.4
—
0.4
—
1/–1
1/–20
IIH/IIL
VI = VDD/0V
—
mA
Input Current 8
—
10/–10
"H" Output Current 1
"H" Output Current 2
"L" Output Current 1
"L" Output Current 2
Output Leakage Current 1, 2, 4
Input Capacitance
–2
—
—
—
—
2
IOH
IOL
–1
mA
VO = 2.4V
10
5
ILO
CI
VO = VDD 0V
/
—
mA
—
—
—
2
f = 1MHz
Ta = 25°C
pF
Output Capacitance
CO
—
7
A/D in operation
A/D stopped
VDD = 2V
—
0.3
0.5
0.2
1
mA
Analog Reference Power
Supply Current
IREF
IDDS
IDDH
IDD
—
10
10
100
10
15
35
40
mA
—
Current Consumption
(during STOP) *
mA
—
—
—
6
Current Consumption
(during HALT)
**
—
—
—
8
f
OSC = 10MHz
No Load
mA
20
30
Current Consumption
**
Note:
1
2
3
4
5
6
7
8
*
Applied to P0
Applied to P1, P2, P3 and P4
Applied to P5
Applied to ALE, PSEN, RD, WR and RESOUT
Applied to RES and NMI
Applied to READY and EA
Applied to FLT
Applied to OSC
0
V
DD
or GND for ports serving as the input pin. No load for any other.
** Applied to MSM66P201/66P207
19/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
AC Characteristics
• External program memory control
(VDD=5V 10%, Ta=–40 to +85°C)
Parameter
Symbol
tfW
Condition
Min.
Max.
—
Unit
Clock (OSC) Pulse
—
50
ALE Pulse Width
tAW
3tfW
—
–20
–20
–20
PSEN Pulse Width
tPW
4tfW
—
PSEN Pulse Delay Time
Low Address Setup time
Low Address Hold Time
High Address Delay Time
High Address Hold Time
Instruction Setup Time
Instruction Hold Time
tPAD
tAAS
tAAH
tAAD
tAPH
tIS
tfW
2tfW
tfW
+20
2tfW
–35
–20
–20
–20
+20
+40
+40
+40
ns
CL = 50pF
tfW
tfW
tfW
tfW
tfW
tfW
100
—
tIH
0
tfW
–20
• External data memory control
(VDD=5V 10%, Ta=–40 to +85°C)
Parameter
Clock (OSC) Pulse
Symbol
tfW
Condition
Min.
Max.
—
Unit
—
50
ALE Pulse Width
tAW
3tfW
—
–20
–20
–20
–20
–20
RD Pulse Width
tRW
4tfW
4tfW
—
WR Pulse Width
tWW
tRAD
tWAD
tAAS
tAAH
tAAD
tARH
tAWH
tMS
—
RD Pulse Delay Time
WR Pulse Delay Time
Low Address Setup Time
Low Address Hold Time
High Address Setup Time
High Address Hold Time
High Address Hold Time
Memory Data Setup Time
Memory Data Hold Time
Data Delay Time
tfW
tfW
2tfW
tfW
+20
+20
tfW
2tfW
–35
–20
–20
–20
–20
+20
+40
+40
+40
+40
tfW
tfW
tfW
tfW
tfW
tfW
tfW
tfW
ns
CL = 50pF
100
—
tMH
0
tfW
tfW
tfW
–20
+40
+40
tDD
tfW
–20
–20
Data Hold Time
tDH
tfW
20/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
CLK
t∆W t∆W
ALE
tAW
PSEN
tPAD
tPW
AD0-7
PC0-7
tAAS
INST0-7
tAAH
tIS
tIH
A8-15
PC8-15
RAP8-15
RAP8-15
tAAD
tAAD
tAAD
tAPH
RD
tRAD
tRW
AD0-7
A8-15
WR
RAP0-7
tAAS tAAH
DIN0-7
tMS
tMH
tAPH
tWAD
tWW
AD0-7
A8-15
RAP0-7
tAAS
DOUT0-7
tAAH
tDD
tDH
tAWH
21/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
• Serial port control
Master mode
(VDD=5V 10%, Ta=–40 to +85°C)
Parameter
Symbol
tfW
Condition
Min.
50
Max.
—
Unit
Clock (OSC) Pulse Width
Serial Clock Pulse Width
Output Data Setup Time
Output Data Hold Time
Input Data Setup Time
Input Data Hold Time
—
—
tSCKW
8tfW
—
tSTMXS
tSTMXH
tSRMXS
tSRMXH
8tfW+40
6tfW–20
2tfW+10
50
—
ns
—
CL=50pF
—
—
Slave mode
(VDD=5V 10%, Ta=–40 to +85°C)
Parameter
Symbol
tfW
Condition
Min.
50
Max.
—
Unit
Clock (OSC) Pulse Width
Serial Clock Pulse Width
Output Data Setup Time
Output Data Hold Time
Input Data Setup Time
Input Data Hold Time
—
—
tSCKW
tSTSXS
tSTSXH
tSRSXS
tSRSXH
8tfW
—
6tfW+40
6tfW–20
100
—
ns
—
CL=50pF
—
100
—
22/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
OSC
t∆W
t∆W
SCK
tSCKW
tSCKW
SDOUT
(TXD)
tSTMXH
tSTMXS
SDIN
(RXD)
Valid
Valid
tSRMXH
tSRMXS
SCK
tSCKW
tSCKW
SDOUT
(TXD)
tSTSXS
tSTSXH
SDIN
(RXD)
Valid
Valid
tSRSXH
tSRSXS
23/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
A/D Converter Characteristics
• Operating range
Parameter
Symbol
VDD
Condition
Min.
4.5
Typ.
—
Max.
5.5
Unit
V
Power Supply Voltage
Analog Reference Voltage
Analog Input Voltage
fOSC £ 10MHz
VR
4.5
—
VDD
VR
VAI
VAG
—
—
VAG = GND = 0V
VDD = 5V 10%
Analog Reference Power
Voltage Resistance
RR
16
—
kW
°C
Operating Temperature
Top
–40
—
+85
• A/D Converter accuracy
Normal operation mode
(VDD=5V 10%, fOSC=10MHz, Ta=–40 to +85°C)
Min.
Typ.
Max.
Parameter
Resolution
Symbol
Condition
Unit
*
*
*
See the
recommended
circuit.
n
—
—
—
0
—
—
—
0
—
—
—
—
—
—
—
—
—
—
—
—
0.5
10
10
Bit
+3.0
+2.0
Absolute Error
Relative Error
EA
ER
EZ
EF
ED
EC
–3.5
–3.5
VR=VDD
1.5
1.0
VAG=GND=0V
Analog input source
impedance
£5kW
Zero Point Error
Full Scale Error
Differential Linearity Error
Crosstalk
+3.0 +2.0
–3.5 –3.5
+3.0 +2.0
LSB
–0.5 –1.0
One channel
conversion time
tC=64ms
—
—
—
—
0.5
—
—
*
V =5V, Ta=25°C
DD
HALT/HOLD operation mode
(VDD=5V 10%, fOSC=10MHz, Ta=–40 to +85°C)
Min.
Typ.
Max.
Parameter
Resolution
Symbol
Condition
Unit
*
*
*
See the
recommended
circuit.
n
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0.5
10
10
Bit
+2.0
+1.0
Absolute Error
Relative Error
EA
ER
EZ
EF
ED
EC
—
—
–3.5
–2.0
VR=VDD
1.0
0.5
VAG=GND=0V
Zero Point Error
Full Scale Error
Differential Linearity Error
Crosstalk
Analog input source +0.5 +0.5
impedance
+2.0 +1.0
–3.5 –2.0
+2.0 +1.0
LSB
–1.0 –1.5
£5kW
One channel
conversion time
tC=64ms
—
—
—
—
0.5
—
—
*
V
DD
=5V, Ta=25°C
24/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
• Recommended circuit
Reference
Voltage
VREF
VDD
+5V
+
+
0.1 47
0.1 47
mF mF
mF mF
RI
–
+
AI0-7
GND
0V
Analog Input
AGND
0.1
mF
R (Analog input source impedance) £ 5kW
I
• A/D Converter conversion characteristics 1
[HEX]
3FF
EF
MAX
EF
MIN
Ideal Conversion (center line)
Actual Conversion width
Conversion Code
Actual Conversion (center line)
000
EZ
EZ
VREF [V]
MIN
MAX
Analog Input
Conversion Characteristics Diagram 1
25/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
Absolute error (E )
A
The absolute error indicates a difference between actual conversion and ideal conversion,
excluding a quantizing error. The absolute error of the A/D converter gets larger as it
approaches the zero point or full scale. (Refer to Conversion Characteristics Diagram 1.)
Relative error (E )
R
The relative error indicates a deviation from a line which connects the center point of the zero
point conversion width with that of the full scale conversion width, excluding a quantizing
error.
The relative error of this A/D converter is almost due to a differential linearity error.
Zero point error (Ez) and full scale error (E )
F
The zero point error and full scale error indicate a difference between actual conversion and
ideal conversion at the zero point and full scale, respectively. (Refer to Conversion
Characteristics Diagram 1.)
A/D Converter Conversion Characteristics 2 (temperature characteristics)
[HEX]
3FF
[LSB]
+4
+25°C
–40°C
+85°C
+3
ES
Conversion
Code
Differential
Linearity
+2
During normal
operation
ES
+1
0
During HALT
ES
000
[°C]
–40
+85
Eta
[V]
Analog Input
Temparature Ta
Conversion Characteristics
Diagram 2-1
Conversion Characteristics
Diagram 2-2
Differential linearity error (E )
D
The differential linearity error indicates a difference between the actual conversion width
(actual step width) and ideal value (1LSB).
With this A/D converter, a voltage for actual conversion is shifted and the inclination of a
voltage is changed, with changes of temperature (see Conversion Characteristics Diagram 2-
1). Specifications described in the foregoing tables are established from Eta shown in
ConversionCharacteristicsDiagram2-1(E =Eta–1LSB). ConversionCharacteristicsDiagram
D
2-2showstemperaturecharacteristicsofdifferentiallinearityofEsinConversionCharacteristics
Diagram 2-1.
26/30
¡ Semiconductor
PACKAGE DIMENSIONS
SDIP64-P-750-1.78
MSM66201/66P201/66207/66P207
(Unit : mm)
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
Cu alloy
Solder plating
5 mm or more
8.70 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
27/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
(Unit : mm)
QFP64-P-1414-0.80-BK
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.87 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
28/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
(Unit : mm)
QFJ68-P-S950-1.27
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
Cu alloy
Solder plating
5 mm or more
4.50 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
29/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
(Unit : mm)
ADIP64-C-750-1.78
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
30/30
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